Lead Field Applications Engineer – High-Speed Interconnect / Semiconductor IP

About

We’re working with an innovative deep-tech semiconductor company developing next-generation high-speed interconnect technology for advanced computing systems.

They are hiring a Lead Field Applications Engineer to support global customers and build a worldwide FAE team.

Location

• Germany – access to Mannheim required (2 days per week minimum)
• Global role supporting customers across Europe, the US and Asia

Key Responsibilities

• Technical lead for global customer engagements
• Support integration, validation and characterisation of semiconductor solutions
• Analyse customer systems, board design and substrates
• Troubleshoot system performance and yield detractors
• Work closely with R&D and product teams
• Build and lead the global FAE team (growing from 1 to 3–5 engineers)

Key Technical Requirements

• Strong semiconductor background – electronic engineering degree (or equivalent) required.
• Knowledge of high-speed interconnects
• Experience with SerDes (strongly preferred)
• Exposure to UCIe / chiplet interconnect ecosystems is highly desirable
• Ability to work closely with complex semiconductor customers

English is the company language – no German required.