Sr. Package Device Product Engineer (PDPE) Engineer

About

As a Package Device Product Engineer (PDPE) at Micron Technology, you will be part of the Package and Development Engineering (PDE) group, a global department with teams located in the USA, Singapore, Malaysia, Taiwan, and India. Your role involves preparing for new DRAM, NAND, or MNAND products and coordinating resources, testing, and analysis over the product lifecycle. Your responsibilities include running data analysis and modeling, creating and maintaining root cause analysis documentation, analyzing parametric, probe level, and electrical test data, and responding to failures. You will collaborate with various Technology Development (TD) & New Product Introduction (NPI) Engineering teams to find the root causes of failed units.

Responsibilities and Tasks

• Enable new test signals in BE to capture assembly-related failures.
• Work with Test Solution Engineering (TSE) & Product Engineering (PE) to standardize test coverages & chars.
• Define Char limits and approve any test-related changes.
• Develop new out-of-control-action-plan (OCAP) and sustain it.
• Provide Lot disposition based on parametric data observation in case of out-of-control (OOC) trigger.
• Ensure that Silicon & assembly process meets Product expectations by analyzing Probe and BE test data.
• Participate in Phase Gate review meetings, present data analysis, and decide on Phase Gate exits related to electrical Test data.
• Analyze test failures, coordinate EFA & PFA to identify the root cause, and implement fixes for fails.
• Find the correlation of test failures to assembly process and update the database with observed signatures.
• Support Global and Local material review board (MRB) in case of excursions and RMA related to package intrinsic design by analyzing electrical test data for root cause analysis (RCA) and assessing material health.

Qualifications Required

• Bachelors/Masters in Electronics, Device Physics, Applied Physics, Electrical.
• Sound knowledge of device physics.
• Knowledge in Engineering Statistics.
• Experience in data (electrical) analysis and modeling (JMP, Spotfire is a plus).
• Experience in programming (Python or Perl).
• Effective communication skills in written and spoken English.
• Good multitasking and organizational skills, able to make decisions in complex situations.
• Excellent problem-solving and analytical skills.

Good to Have

• Experience in NAND/DRAM memory or related field.
• Knowledge in semiconductor packaging assembly processes.
• Experience in fabrication processes, electrical characterization techniques, metrology techniques.